DURABIO™ HI
May 15

DURABIO™ HI

DURABIO™ HI

DURABIO™ HI developed for 3D FFF/FDM printing is a transparent bio-based engineering material developed by Mitsubishi Chemical. DURABIO™ HI is a transparent polymer with a high transparency similar to PMMA but with a much better impact behavior and improved heat resistance. DURABIO™ HI beats the well-known inferior properties of PC in regards to scratch resistance, hardness and chemical resistance. That is why DURABIO™ HI closes the gap between PC and PMMA.

DURABIO™ HI features:

• Excellent optical and mechanical properties
• Superb UV-resistance
• Ductility, with strong impact resistance
• High heat resistance
• Scratch resistance
• Chemical inertness
• Biobased BPA free
• Easy to print

Sizeø toleranceRoundness
1,75mmø 0,05mm95%
2,85mmø 0,10mm95%
DescriptionTestmethodTypical value
Specific gravity g/cm³
ISO 11831.31 g/cm³
MFI 230°C/2,16kgISO 1183
13 g/10min
Tensile Strength at Yield
ISO 527
64 MPa
Elongation-Strain at Break
ISO 527130%
Tensile (E) modulusISO 5272300 MPa
Impact Strength Charpy method 23°C
(notched)
ISO 1799 kJ/m²
Flexural Modulus
ISO 178
2100 MPa
Flexural StrengthISO 17894 MPa
Heat deflection temperature HDT BISO 75
92°C
Heat deflection temperature HDT AISO 7582°C
TransmittanceISO 1346892%
DescriptionTestmethodTypical value
Printing temp.230±10°C
Bed Temperature100°C
Layer Height0.2mm
Print Speed50 mm/s

Colours:

DURABIO™ HI is available from stock in:

bk1
cl1
wh1

Packaging:

DURABIO™ HI is available in the original packaging of Mitsubishi Chemical.

Additional info:

DURABIO™ HI is particularly designed for applications requiring exceptional visual appearance with scratch and impact resistance as well as chemical inertness.


Storage:

In order to prevent moisture pick up and contamination, supplied packaging should be kept closed and undamaged. For the same reason, partially used bags should be sealed before re-storage. Allow the material that has been stored elsewhere to adapt to the temperature in the processing room while keeping the bag closed.